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A Bulk-Micromachined Comb Accelerometer With Floating Interconnects

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dc.contributor.advisor Xiong, Xingguo en_US
dc.contributor.author Xiong, Xingguo en_US
dc.contributor.author Lu, Deren en_US
dc.contributor.author Wang, Weiyuan en_US
dc.date.accessioned 2014-07-16T16:58:19Z
dc.date.available 2014-07-16T16:58:19Z
dc.date.issued 2005-08-07 en_US
dc.identifier.other 0a1a9fbd-8c26-0323-b400-b7c301b3cecf en_US
dc.identifier.uri https://scholarworks.bridgeport.edu/xmlui/handle/123456789/800
dc.description.abstract In this paper, a novel silicon-on-glass bulk micromachined comb accelerometer with floating interconnect is introduced. The device uses unique floating back interconnect for the connection of the fixed comb fingers, which leads to more compact design. Based upon the analysis of the device behavior, an optimized device design is proposed. Simulation results show that the device has a static capacitance of 2.8pF and sensitivity of 17.9nm/g. The fabrication sequence of the accelerometer is discussed. The novel floating interconnection technique may be applied to other bulk micromachined MEMS devices for 3D interconnection. en_US
dc.description.uri http://ieeexplore.ieee.org.libproxy.bridgeport.edu/stamp/stamp.jsp?tp=&arnumber=1594060 en_US
dc.publisher IEEE en_US
dc.subject Micro-electro-mechanical systems (MEMS) en_US
dc.subject Accelerometer en_US
dc.subject Bulk-micromachining en_US
dc.subject Floating interconnect en_US
dc.subject Silicon on glass (SOG) en_US
dc.title A Bulk-Micromachined Comb Accelerometer With Floating Interconnects en_US
dc.type Article en_US
dc.event.location Cincinnati, Ohio, USA en_US
dc.event.name 48th IEEE International Midwest Symposium on Circuits & Systems (MWSCAS-05) en_US

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