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Yield Analysis for Self-Repairable MEMS Devices

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dc.contributor.advisor Xiong, Xingguo en_US
dc.contributor.author Wu, Yu-Liang en_US
dc.contributor.author Jone, Wen-Ben en_US
dc.date.accessioned 2014-07-16T16:52:39Z
dc.date.available 2014-07-16T16:52:39Z
dc.date.issued 2005-08-07 en_US
dc.identifier.other 72e2bb23-84ff-4250-ba63-dd23cbbbec42 en_US
dc.identifier.uri https://scholarworks.bridgeport.edu/xmlui/handle/123456789/699
dc.description.abstract In this paper, the yield analysis for a selfrepairable MEMS (SRMEMS) accelerometer design is proposed. The accelerometer consists of(n+m) identical modules: n of them serve as the main device, while the remaining m modules act as the redundancy. The yield model for MEMS redundancy repair is developed by statistical analysis. Based upon the yield model, the yield increase after redundancy repair for the SRMEMS accelerometer is derived. The yield increase versus initial yield for different m numbers is simulated. The simulation results show that the SRMEMS leads to effective yield increase compared to non-BISRS design, especially for a moderate initial yield. en_US
dc.description.uri http://ieeexplore.ieee.org.libproxy.bridgeport.edu:9000/stamp/stamp.jsp?tp=&arnumber=1594112 en_US
dc.publisher IEEE en_US
dc.subject Yield analysis en_US
dc.subject Built-in self-repair (BISR) en_US
dc.subject Micro-electro-mechanical systems (MEMS) en_US
dc.subject Micro-accelerometer en_US
dc.subject Redundancy repair en_US
dc.subject Computer engineering en_US
dc.subject Computer science en_US
dc.subject Engineering en_US
dc.subject Wireless communication en_US
dc.title Yield Analysis for Self-Repairable MEMS Devices en_US
dc.type Article en_US
dc.event.location Cincinnati, Ohio, USA en_US
dc.event.name 47th IEEE International Midwest Symposium on Circuits & Systems (MWSCAS?05) en_US


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