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Numerical Study on the Thermal Performance of Embedded Heat Pipes for CPU Cooling

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dc.contributor.author Eskandar, Alan
dc.contributor.author Hu, Junling
dc.date.accessioned 2016-05-25T14:27:25Z
dc.date.available 2016-05-25T14:27:25Z
dc.date.issued 2016-04-01
dc.identifier.uri https://scholarworks.bridgeport.edu/xmlui/handle/123456789/1635
dc.description.abstract Thermal management of central processing units (CPU) becomes more challenging in the development and production of high performance computers with faster and smaller size CPUs. Heat pipes are two-phase cooling devices with an effective thermal conductivity over 200 times higher than that of a copper heat sink. In addition, heap pipes have light weight, low cost and the flexibility of many different sizes and shape options which can be embedded into the metallic heat sink to provide more efficient thermal management. In this project, CFD was used to study a heap pipe embedded CPU cooler. The simulated results is validated with the experimental data for the same CPU cooler. Golf ball fans were also introduced to replace the stock fans in the CPU cooler to enhance the heat transfer and lower the operating temperature. The detailed distributions of temperature, velocity, and pressure were used to analyze the performance of the CPU cooler in both cases and found the golf ball fans are more effective than the stock fans. en_US
dc.language.iso en_US en_US
dc.subject Central processing unit (CPU) en_US
dc.subject Heat pipes en_US
dc.subject Thermal management en_US
dc.title Numerical Study on the Thermal Performance of Embedded Heat Pipes for CPU Cooling en_US
dc.type Presentation en_US
dc.institute.department School of Engineering en_US
dc.institute.name University of Bridgeport en_US
dc.event.location Bridgeport, CT en_US
dc.event.name Faculty Research Day en_US

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