Structure Design and Fabrication of Symmetric Force-balance Micromachining Capacitive Accelerometer
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Authors
Zou, Qiang
Lu, Deren
Li, Baoqing
Xiong, Xingguo
Xiong, Bin
Wang, Weiyuan
Issue Date
1997-09-29
Type
Article
Language
en_US
Keywords
Engineering , Micromachining , Maskless anisotropic etching , Accelerometer , Computer engineering , Engineering , Modern materials , Micro-electro-mechanical systems (MEMS)
Alternative Title
Abstract
A novel KOH silicon maskless anisotropic etching technology is adopted to fabricate micromachining silicon mass-beam structure accelerometer. Lateral sensitivity effect in normal accelerometer is eliminated because the beams which are thinner than 15 micrometers have been formed in the middle of the seismic mass. Based on the calculation of sensitivity and basic resonance frequency of two kinds of bulk micromachining accelerometers, the structure parameters of cantilever and double-side-supported accelerometer have been optimized by using the sensitivity-frequency product as the figure of merit of a structure. The different etching characteristics of {311} and {100} plane of silicon in KOH maskless anisotropic etching process have been investigated thoroughly and utilized in the fabrication of symmetric mass- beam structure. Special damping design has been proposed to reduce the damping ratio of the device in order to improve the dynamic performance of the accelerometer. Preliminary measurement of the static characteristics of the structure has been performed with a force-deflection balance measurement apparatus.
Description
Copyright 1997 Society of Photo-Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.
Citation
Qiang Zou ; Deren Lu ; Baoqing Li ; Xingguo Xiong ; Bin Xiong, et al. "Structure design and fabrication of symmetric force-balance micromachining capacitive accelerometer", Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, 284 (September 5, 1997); doi:10.1117/12.284492
Publisher
SPIE