COMSOL Simulation of MEMS Piezoelectrically Actuated Micropump
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Authors
Zhan, Wei
Li, Chengsi
Xiong, Xingguo
Patra, Prabir
Hu, Junling
Issue Date
2014-03-28
Type
Presentation
Language
en_US
Keywords
Engineering , Faculty research day , Micropump , Micro-electro-mechanical systems (MEMS) , COMSOL
Alternative Title
Abstract
In this poster, the design and COMSOL simulation of a piezoelectric micropump with dome-shaped diaphragms and diffuser-nozzle fluid rectifiers is reported. The micropump uses piezoelectric ZnO film (less than 10μm thick) to actuate the vibration of a parylene dome diaphragm, so that microfluid can be pumped in and out of the chamber. The device is to be fabricated on silicon substrate with an IC-compatible process. Piezoelectric ZnO film is sputter-deposited on a parylene dome diaphragm with its C-axis oriented perpendicular to the dome surface. The micropump utilizes two symmetric dome diaphragms for improved pumping rate. Diffuser-nozzle elements are integrated with piezoelectrically actuated dome diaphragms to form a multi-chip micropump. Due to the MEMS (Microelectromechanical Systems) technology used, the proposed micropump has very small size (10×10×1.6mm3) and consumes extremely low power. It also shows negligible leakage up to 700 Pa static differential pressure. The function of the proposed micropump is verified with COMSOL simulation.