Reliability Analysis of Self-Repairable MEMS Accelerometer
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Authors
Xiong, Xingguo
Wu, Yu-Liang
Jone, Wen-Ben
Issue Date
2008-12-05
Type
Article
Language
en_US
Keywords
Micro-electro-mechanical systems (MEMS) , Redundancy repair , Reliability , Micro-accelerometer , Fracture probability
Alternative Title
Abstract
MEMS (Microelectromechanical System) yield and reliability have been a very critical issue. In our previous paper, we have proposed a self-repairable MEMS comb accelerometer device, and the yield analysis has demonstrated effective yield increase due to the BISR (built-in self-repair) design. In this paper, we developed a MEMS reliability model for quantitative assessment of the MEMS reliability analysis. Based on this model, we analyze the reliability of both non-BISR and BISR MEMS comb accelerometers under Z-axis shocking environment. Simulation results demonstrate very effective reliability enhancement due to the BISR design. The reliability model can also be applied to other MEMS devices under various failure mechanisms in a similar way.
Description
© 2008 IEEE. Reprinted, with permission, from [Xiong, Xingguo; Wu, Yu-Liang; Jone, Wen-Ben, Reliability Analysis of Self-Repairable MEMS Accelerometer, IEEE International Joint Conferences on Computer, Information, and Systems Sciences, and Engineering, 12-2008. The final published version can be found at the link below.
Citation
Publisher
IEEE