Reliability Model for MEMS Accelerometers

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Authors

Xiong, Xingguo
Wu, Yu-Liang
Jone, Wen-Ben

Issue Date

2008

Type

Article

Language

en_US

Keywords

Engineering , Micro-electro-mechanical systems (MEMS) , Redundancy repair , Reliability , Accelerometer , Fracture probability

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Abstract

MEMS (Microelectromechanical System) reliability is a very critical issue for its commercial applications. In order to measure the reliability of MEMS, a systematic reliability model is required. In this paper, we developed a MEMS reliability model for quantitative assessment of the MEMS reliability analysis. Based on this model, we analyze the reliability of both BISR (built-in-self-repairable) and non-BISR MEMS comb accelerometers under Z-axis shocking environment. Simulation results demonstrate very effective reliability enhancement due to the BISR design. The reliability model can also be applied to other MEMS devices under various failure mechanisms in a similar way.

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The final publication is available at www.springerlink.com

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Springer Netherlands

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Springer Netherlands

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