Numerical Study on the Thermal Performance of Embedded Heat Pipes for CPU Cooling
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Authors
Eskandar, Alan
Hu, Junling
Issue Date
2016-04-01
Type
Presentation
Language
en_US
Keywords
Central processing unit (CPU) , Heat pipes , Thermal management
Alternative Title
Abstract
Thermal management of central processing units (CPU) becomes more challenging in the development and production of high performance computers with faster and smaller size CPUs. Heat pipes are two-phase cooling devices with an effective thermal conductivity over 200 times higher than that of a copper heat sink. In addition, heap pipes have light weight, low cost and the flexibility of many different sizes and shape options which can be embedded into the metallic heat sink to provide more efficient thermal management. In this project, CFD was used to study a heap pipe embedded CPU cooler. The simulated results is validated with the experimental data for the same CPU cooler. Golf ball fans were also introduced to replace the stock fans in the CPU cooler to enhance the heat transfer and lower the operating temperature. The detailed distributions of temperature, velocity, and pressure were used to analyze the performance of the CPU cooler in both cases and found the golf ball fans are more effective than the stock fans.