The Use of Data Envelopment Analysis for Product Recovery
Loading...
Authors
Kongar, Elif
Gupta, Surendra M.
McGovern, Seamus M.
Issue Date
2003-10-29
Type
Article
Language
en_US
Keywords
End-of-life processing , Product recovery , Data envelopment analysis
Alternative Title
Abstract
The latest enhancements in industrial technologies, especially the ones in electronics industry, have provided organizations with the ability to manufacture faster and more economical products. This fact, coupled with the growing interest and demand for the latest technology, have led electronic equipment manufacturers to start producing “hightech” and “personalized” products at an increasing rate. This has led to a high rate of obsolescence for electronic products worldwide, even though the majority of these “obsolete” products still function. In this paper, we investigate a product recovery facility where the end-of-life (EOL) products are taken back from the last users and are brought into the facility for processing. We assume that there are multiple types of EOL products and that a combination of these can be disassembled to provide for a sufficient number of demanded components and materials. We then present a data envelopment analysis (DEA) algorithm to determine the number and types of the EOL products that will be required to fulfill the demand. A numerical example is presented to demonstrate the functionality of the methodology.
Description
Copyright 2003 Society of Photo-Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.
Citation
Kongar, E., Gupta, S. M. and McGovern, S. M., "The Use of Data Envelopment Analysisfor Product Recovery", Proceedings of the SPIE International Conference on Environmentally Conscious Manufacturing III, Providence, Rhode Island, pp. 219-231, October 29-30, 2003.
Publisher
SPIE